硅透镜阵列是利用硅基半导体芯片加工工艺(包括光刻、刻蚀、光学镀膜、晶圆切割等)，在硅基片表面制备出硅基球面、非球面透镜及透镜阵列。产品具备精度高，一致性好，易于批量生产等优势。
插损小/低损耗
高精确度
高稳定性和可靠性
量产交付迅速
| Parameter | Process Capability |
| Material | Silicon; 4 or 6 inch Wafer |
| Thinkness | 300/400/500/1000+15um or other spec |
| Lens Diameter | 10um~800um |
| Pitch Accuracy | ±0.5um or other |
| ROC Uniformity (lens-lens in array) | ±1% |
| Median ROC Variation(array-to-array) | ±5% |
| Surface Profile Deviation | <35nm rms |
| AR Coating | <0.2% Per Side |
